Durable Light-Curable Electronic Assembly/Circuit Board Sealer by Dymax
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Product details
| Management number | 213686761 | Release Date | 2026/04/12 | List Price | US$36.00 | Model Number | 213686761 | ||
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Dymax's Multi-Cure 9001-E-V3.0 is a high-performance encapsulant offering enhanced moisture and thermal cycle resistance, along with superior adhesion to diverse component substrates. It cures rapidly, in as little as 5 seconds, under LED, longwave UV, and visible light, exhibiting excellent environmental resistance and ionic/electrical properties. This material features a secondary heat cure for shadowed areas and demonstrates outstanding adhesion to PC boards and electronic components, making it ideal for chip-on-board, chip-on-flex, and multi-chip modules.
- Rapid processing with UV/Visible light cure
- Multi-Cure: Heat cure for shadowed areas
- Convenient one-part formulation, no mixing required
- Low glass transition temperature, low modulus for wire bonding
- No added solvents
- Isocyanate-free formulation
- Compliant with RoHS directive 2015/863/EU
| Color | Clear |
|---|---|
| Brand Name | Dymax |
| Material Type | Acrylic |
| Compatible Material | Ceramic; Lead Frame; Pcb; Flex; Silicon |
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